| 引用本文: | 朱清华,潘泓廷.双臂机械手组合设备在清洁情况下的调度优化[J].控制理论与应用,2025,42(9):1858~1866.[点击复制] |
| ZHU Qing-hua,PAN Hong-ting.Scheduling a dual-arm cluster tool with a cleaning operation[J].Control Theory & Applications,2025,42(9):1858~1866.[点击复制] |
|
| 双臂机械手组合设备在清洁情况下的调度优化 |
| Scheduling a dual-arm cluster tool with a cleaning operation |
| 摘要点击 3642 全文点击 160 投稿时间：2023-07-16 修订日期：2025-02-09 |
| 查看全文 查看/发表评论 下载PDF阅读器 HTML |
| DOI编号 10.7641/CTA.2024.30489 |
| 2025,42(9):1858-1866 |
| 中文关键词 半导体制造 腔室清洁 调度 组合设备 |
| 英文关键词 semiconductor manufacturing chamber cleaning scheduling cluster tools |
| 基金项目 广东省自然科学基金项目(2022A1515011310)资助. |
|
| 中文摘要 |
| 在半导体晶圆加工过程中,组合设备中的加工腔环境达到污染阈值时需要进行清洁以确保加工晶圆质量.
针对存在晶圆驻留时间约束及并行加工腔配置的双臂机械手组合设备,在一个加工腔达到污染阈值需进行清洁操
作的情况,本文研究了机械手的调度.由于加工腔需清洁,组合设备的生产周期会变长.为此,本文提出了加载虚拟
晶圆的方法来延长生产周期并使机械手的活动顺序与清洁前保持一致,使得清洁操作能获得足够的时间来完成.
在确保正常运行的加工腔中晶圆的驻留时间约束得到满足的条件下,根据各步骤的工作负载平衡的不同情况,提出
算法采用解析式推导计算新的生产周期和机械手等待事件的持续时间,使组合设备进入暂态进行清洁操作以及使
组合设备恢复到稳态过程运行.本文提出的多项式复杂度的算法,提高了双臂机械手组合设备在清洁情况下的生
产效率. |
| 英文摘要 |
| In a semiconductor manufacturing factory, a cluster tool consists of several process chambers and a robot
for transporting wafers. During wafer fabrication, a process chamber must be cleaned when its processing environment
reaches a contamination threshold to ensure wafer quality. This work focuses on a dual-arm cluster tool with parallel
process chambers when wafer residency time constraints are imposed on processed wafers. The chamber must be cleaned
when the contamination accumulates to a given threshold. This work studies the scheduling of the robot for such a scenario.
Due to a cleaning operation, the cycle time of a cluster tool must be extended. To this end, this work proposes a method
based on a virtual wafer, which can 1) keep the robot operation sequence the same as before the cleaning operation and
2) obtain enough time to perform a cleaning operation. When the wafer residency time constraints at the regular steps are
satisfied, we analyze the workload balance of process steps for a cluster tool and propose algorithms based on closed-form
calculations. The algorithms can 1) determine the variable cycle time of a cluster tool and the robot waiting time before
unloading a wafer, 2) switch a cluster tool from a steady state to a cleaning transient state, and 3) back to an original steady
state. The computational complexity of the proposed algorithms is polynomial and can improve the productivity of a cluster
tool in the case of a cleaning operation. |
|
|
|
|
|